Representation of a Thermal Resistor Network Model of a Packaged Component in STEP AP210 Edition 2

Published

December 4, 2009

Author(s)

Jamie Stori, Kevin G. Brady, Thomas Thurman

Abstract

STEP AP210 (ISO-10303:210) is the first international standard capable of representing both ECAD and MCAD data of packaged components within a unified model. In order to promote AP210 as a standards-based mechanism for the representation of component data, it is desired to demonstrate the ability of AP210 to support a variety of domain-specific data requirements in the design and product-realization process for electronic assemblies and products. Prior work and existing implementations have validated the ability of AP210 to serve as a neutral format for the representation of conventional ECAD data for individual components as well as bare boards (PCB / PWB) and assemblies (PCA / PWA). To date, AP210 has not been validated as a representation mechanism for communicating the analytical models and/or data necessary to support mechanical analysis (i.e. thermal and vibration) of electronic assemblies. Being able to predict the package and die temperatures of components to a reasonable degree of accuracy in an assembly under expected operating conditions is critical to the effective design of modern electronic products. In order to support the thermal analysis requirements of designers, while balancing the concerns of component suppliers to protect proprietary details of their products, there has been an increasing emphasis on the role of compact thermal models of components.

Citation

NIST Interagency/Internal Report (NISTIR) - 7648

Report Number

7648

NIST Pub Series

NIST Interagency/Internal Report (NISTIR)

Pub Type

NIST Pubs

Download Paper

Local Download

Keywords

STEP, AP210, Thermal

Citation

Stori, J. , Brady, K. and Thurman, T. (2009), Representation of a Thermal Resistor Network Model of a Packaged Component in STEP AP210 Edition 2, NIST Interagency/Internal Report (NISTIR), National Institute of Standards and Technology, Gaithersburg, MD, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=903903 (Accessed April 23, 2024)