Recent Advances in Ac-dc Transfer Measurements Using Thin-Film Thermal Converters

Published

January 1, 2001

Author(s)

Thomas F. Wunsch, Joseph R. Kinard Jr., Ronald R. Manginell, Thomas E. Lipe Jr., O. P. Solomon, K. C. Jungling

Abstract

New standards for ac current and voltage measurements, thin-film multijunction thermal converters (MJTCs), have been fabricated using thin-film and micro-electro-mechanical systems (MEMS) technology. Improved sensitivity and accuracy over single-junction thermoelements and targeted performance allow new measurement approaches in traditionally troublesome areas such as the low frequency and high current regimes. A review is presented of new microfabrication techniques and packaging methods that have resulted from a collaborative effort at Sandia National Laboratories and the National Institute of Standards and Technology (NIST).

Proceedings Title

Proc., Measurement Science Conference

Conference Dates

January 18-19, 2001

Conference Location

Anaheim, CA

Pub Type

Conferences

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Keywords

ac-dc difference, Bosch etch, deep reactive ion etch, planar thermal converter, thin-film converter

Citation

Wunsch, T. , Kinard Jr., J. , Manginell, R. , Lipe Jr., T. , Solomon, O. and Jungling, K. (2001), Recent Advances in Ac-dc Transfer Measurements Using Thin-Film Thermal Converters, Proc., Measurement Science Conference, Anaheim, CA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=24633 (Accessed October 13, 2025)