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Recent Advances in Ac-dc Transfer Measurements Using Thin-Film Thermal Converters



Thomas F. Wunsch, Joseph R. Kinard Jr., Ronald R. Manginell, Thomas E. Lipe Jr., O. P. Solomon, K. C. Jungling


New standards for ac current and voltage measurements, thin-film multijunction thermal converters (MJTCs), have been fabricated using thin-film and micro-electro-mechanical systems (MEMS) technology. Improved sensitivity and accuracy over single-junction thermoelements and targeted performance allow new measurement approaches in traditionally troublesome areas such as the low frequency and high current regimes. A review is presented of new microfabrication techniques and packaging methods that have resulted from a collaborative effort at Sandia National Laboratories and the National Institute of Standards and Technology (NIST).
Proceedings Title
Proc., Measurement Science Conference
Conference Dates
January 18-19, 2001
Conference Location
Anaheim, CA


ac-dc difference, Bosch etch, deep reactive ion etch, planar thermal converter, thin-film converter


Wunsch, T. , Kinard Jr., J. , Manginell, R. , Lipe Jr., T. , Solomon, O. and Jungling, K. (2001), Recent Advances in Ac-dc Transfer Measurements Using Thin-Film Thermal Converters, Proc., Measurement Science Conference, Anaheim, CA, [online], (Accessed May 28, 2024)


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Created December 31, 2000, Updated October 12, 2021