Enright, L.
, Olszewska-Placha, M.
, Hill, M.
, Phommakesone, S.
, Kato, D.
, Hill, C.
, Kahari, H.
, Lee, C.
, Chen, C.
, Orloff, N.
, Celuch, M.
and Ray, U.
(2023),
Preparing for 6G: Developing best practices and standards for industrial measurements of low-loss dielectrics, 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, JP, [online], https://doi.org/10.23919/ICEP58572.2023.10129693, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936252
(Accessed May 4, 2024)
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Preparing for 6G: Developing best practices and standards for industrial measurements of low-loss dielectrics
Published
Author(s)
, Marzena Olszewska-Placha, Michael Hill, Say Phommakesone, Daisuke Kato, Charles Hill, Hanna Kahari, Chiawen Lee, Chang-Sheng Chen, , Malgorzata Celuch, Urmi Ray
Abstract
With growing interest in millimeter-wave (mmWave, 30 GHz – 300 GHz) technologies, researchers and manufacturers need standard reference materials and best practices for measurement validation, material acceptance, and quality assurance. Today, there is no standard reference material for dielectric permittivity and loss tangent in the mmWave regime. Here, we show the results of round robin experiments that evaluate the current state-of-the-art methods in dielectric measurements. Due to the wide spread in these results, we identify the need for a standard reference material at mmWave.Proceedings Title
2023 International Conference on Electronics Packaging (ICEP)
Conference Dates
April 19-22, 2023
Conference Location
Kumamoto, JP
Pub Type
Conferences
Download Paper
Keywords
Dielectrics, measurements, mmWave, standard reference material
Citation
Created May 23, 2023, Updated December 22, 2023