TY  - CONF
AU  - Lucas Enright
AU  - Marzena Olszewska-Placha
AU  - Michael Hill
AU  - Say Phommakesone
AU  - Daisuke Kato
AU  - Charles Hill
AU  - Hanna Kahari
AU  - Chiawen Lee
AU  - Chang-Sheng Chen
AU  - Nate Orloff
AU  - Malgorzata Celuch
AU  - Urmi Ray
C2  - 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, JP
DA  - 2023-05-23 04:05:00
DO  - https://doi.org/10.23919/ICEP58572.2023.10129693
LA  - en
PB  - 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, JP
PY  - 2023
TI  - Preparing for 6G: Developing best practices and standards for industrial measurements of low-loss dielectrics
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936252
ER  -