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New SWEAT Method for Fast, Accurate, and Stable Electromigration Testing on Wafer Level

Published

Author(s)

Jochen von Hagen, G. Antonin, J. Fazekas, Linda M. Head, Harry A. Schafft

Abstract

The Standard Wafer Level Electromigration Accelerated Test (SWEAT) is one of a few highly accelerated stress tests of metal line test structures that are used to monitor electromigration resistance. Earlier works and our own examinations have shown that when the JEDEC standard SWEAT method is used. Unexpetedly large sigmas are observed that could sometimes be traced to the existence of bimodal failure-time distributions. We show that the cause for these anomalous behaviors is the algorithm in the JEDEC standard method that is used in the control loop to adjust the stress current so that a constant target failure time is maintained. An alternative algorithm is described and experimental results are given to demonstrate its effectiveness.
Citation
2000 IRW Final Report

Keywords

accelerated stress tests, electromigration, interconnects (electrical), reliability, standard test method, SWEAT, test method, wafer-level testing

Citation

von Hagen, J. , Antonin, G. , Fazekas, J. , Head, L. and Schafft, H. (2000), New SWEAT Method for Fast, Accurate, and Stable Electromigration Testing on Wafer Level, 2000 IRW Final Report (Accessed May 29, 2024)

Issues

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Created December 30, 2000, Updated October 12, 2021