von Hagen, J.
, Antonin, G.
, Fazekas, J.
, Head, L.
and Schafft, H.
(2000),
New SWEAT Method for Fast, Accurate, and Stable Electromigration Testing on Wafer Level, 2000 IRW Final Report
(Accessed January 26, 2025)
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New SWEAT Method for Fast, Accurate, and Stable Electromigration Testing on Wafer Level
Published
Author(s)
Jochen von Hagen, G. Antonin, J. Fazekas, ,
Abstract
The Standard Wafer Level Electromigration Accelerated Test (SWEAT) is one of a few highly accelerated stress tests of metal line test structures that are used to monitor electromigration resistance. Earlier works and our own examinations have shown that when the JEDEC standard SWEAT method is used. Unexpetedly large sigmas are observed that could sometimes be traced to the existence of bimodal failure-time distributions. We show that the cause for these anomalous behaviors is the algorithm in the JEDEC standard method that is used in the control loop to adjust the stress current so that a constant target failure time is maintained. An alternative algorithm is described and experimental results are given to demonstrate its effectiveness.Citation
2000 IRW Final Report
Pub Type
Others
Keywords
accelerated stress tests, electromigration, interconnects (electrical), reliability, standard test method, SWEAT, test method, wafer-level testing
Citation
Issues
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Created December 30, 2000, Updated October 12, 2021