DeGroot, D.
and Williams, D.
(1998),
National Institute of Standards and Technology Programs in Electrical Measurements for Electronic Interconnections, Proc., Electrical Performance of Electronic Packaging., West Point, NY, US, [online], https://doi.org/10.1109/EPEP.1998.733747, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=7607
(Accessed April 23, 2024)
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National Institute of Standards and Technology Programs in Electrical Measurements for Electronic Interconnections
Published
Author(s)
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Abstract
Abstract: The National Institute of Standards and Technology operates a number of research projects to advance measurement science and technology for the microelectronic industries. We report here on one component of the NIST program, the fundamental electrical characterization of electronic interconnections through accurate measurement. We have developed and continue to develop measurement techniques for fully calibrated time-domain network analysis, lossy transmission lines on silicon, coupled transmission lines, fully calibrated multiport network analysis, low dielectric constant thin-film materials, and at-speed test.Proceedings Title
Proc., Electrical Performance of Electronic Packaging.
Conference Dates
October 26-28, 1998
Conference Location
West Point, NY, US
Conference Title
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Pub Type
Conferences
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Citation
Created September 30, 1998, Updated October 12, 2021