Schuster, C.
, Vangel, M.
and Schafft, H.
(2001),
Improved Estimation of the Resistivity of Pure Copper Electrical Determination of Thin Copper Film Dimensions, Microelectronics Reliability
(Accessed October 4, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Improved Estimation of the Resistivity of Pure Copper Electrical Determination of Thin Copper Film Dimensions
Published
Author(s)
C. E. Schuster, ,
Abstract
Improved values for the resistivity, ?, of pure, bulk copper from 50 K to 1200 K, and their confidence intervals, are developed by extending the analysis of Matula. A recommended value for d?/dT and its confidence interval in the temperature range of 290 K to 425 K is developed for use with Matthiessen's rule to calculate the electrical thickness of thin copper films and the cross-sectional area of copper lines from resistance measurements at two temperatures. Error analyses are used to estimate the uncertainty with which the electrical thickness and cross-sectional area can be determined. Values for the temperature coefficient of resistance of pure, bulk copper are also provided.Citation
Microelectronics Reliability
Pub Type
Journals
Keywords
copper, electrical measurements, integrated circuits, interconnects, reliability, resisivity, film thickness
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created January 31, 2001, Updated October 12, 2021