Haidinger Interferometer for Silicon Wafer TTV Measurement

Published

August 22, 2001

Author(s)

R E. Parks, L Z. Shao, Angela Davies, Christopher J. Evans

Abstract

We describe a novel configuration for a Haidinger fringe, phase shifting, interferometer to measure the total thickness variation (TTV) of 300mm silicon wafers. The interferometer has only one optical element that is on the order of the size of the wafer under test, a concave spherical mirror of moderate quality. Further, the interferometer has no moving parts, the phase shifting being done by changing the wavelength of a tunable 1.55 micrometer diode laser. Because of the modest size and quality of the optics, and no moving parts, the interferometer is robust, compact and relatively inexpensive given the 300mm aperature.

Citation

Characterization and Metrology for ULSI Technology Conference

Pub Type

Journals

Keywords

Interferometry, Metrology, Total Thickness Variation, Wafer TTV

Citation

Parks, R. , Shao, L. , Davies, A. and Evans, C. (2001), Haidinger Interferometer for Silicon Wafer TTV Measurement, Characterization and Metrology for ULSI Technology Conference (Accessed June 17, 2025)