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PUBLICATIONS

Evaluation of Secco Etch Technique for Determination of Dislocation Densities in SIMOX Wafers, Extended Abstract

Published

Author(s)

E. Cortesi, M. K. El-Ghor, H. H. Hosack, L. P. Allen, Peter Roitman, S. J. Krause
Proceedings Title
Proc., 1991 IEEE International SOI Conference
Conference Dates
October 1-3, 1991
Conference Location
Vail Valley, CO, USA
Pub Type
Conferences

Citation

Cortesi, E. , El-Ghor, M. , Hosack, H. , Allen, L. , Roitman, P. and Krause, S. (1991), Evaluation of Secco Etch Technique for Determination of Dislocation Densities in SIMOX Wafers, Extended Abstract, Proc., 1991 IEEE International SOI Conference, Vail Valley, CO, USA (Accessed January 14, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created December 30, 1991, Updated October 12, 2021