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Evaluation of Secco Etch Technique for Determination of Dislocation Densities in SIMOX Wafers, Extended Abstract

Published

Author(s)

E. Cortesi, M. K. El-Ghor, H. H. Hosack, L. P. Allen, Peter Roitman, S. J. Krause
Proceedings Title
Proc., 1991 IEEE International SOI Conference
Conference Dates
October 1-3, 1991
Conference Location
Vail Valley, CO, USA

Citation

Cortesi, E. , El-Ghor, M. , Hosack, H. , Allen, L. , Roitman, P. and Krause, S. (1991), Evaluation of Secco Etch Technique for Determination of Dislocation Densities in SIMOX Wafers, Extended Abstract, Proc., 1991 IEEE International SOI Conference, Vail Valley, CO, USA (Accessed February 22, 2024)
Created December 30, 1991, Updated October 12, 2021