NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

PUBLICATIONS

Effects of Lightpipe Proximity on Si Wafer Temperature in Rapid Thermal Processing Tools

Published

Author(s)

K G. Kreider, D H. Chen, W A. Kimes, D P. DeWitt, Benjamin K. Tsai
Proceedings Title
2003 Int''l Conf. Characterization and Metrology for ULSI Technology
Conference Dates
March 24-28, 2003
Conference Location
Austin, TX, USA
Conference Title
Proc. 2003 Int'l Conf. Characterization and Metrology for ULSI Technology
Pub Type
Conferences

Citation

Kreider, K. , Chen, D. , Kimes, W. , DeWitt, D. and Tsai, B. (2003), Effects of Lightpipe Proximity on Si Wafer Temperature in Rapid Thermal Processing Tools, 2003 Int''l Conf. Characterization and Metrology for ULSI Technology , Austin, TX, USA (Accessed October 7, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created December 31, 2002, Updated October 12, 2021
Was this page helpful?