Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Dielectric Measurements of Substrates and Packaging Materials

Published

Author(s)

James R. Baker-Jarvis, Billy F. Riddle

Abstract

We summarize measurement results on many polymer, ceramic, and composite substrate and packaging materials. Measurements on low-loss materials are obtained from closed and open cavity resonators, as well as dielectric-resonator methods. Measurements of the same material by different techniques are compared. Results indicate that consistent measurements can be obtained with a number of well-characterized fixtures.
Proceedings Title
Proc., Intl. Conf. on High Density Interconnect and System Packaging
Conference Dates
April 26-28, 2000
Conference Location
Denver, CO

Keywords

dielectric, electronic packaging, measurements, packaging materials, resonators, substrates

Citation

Baker-Jarvis, J. and Riddle, B. (2000), Dielectric Measurements of Substrates and Packaging Materials, Proc., Intl. Conf. on High Density Interconnect and System Packaging, Denver, CO (Accessed April 20, 2024)
Created March 31, 2000, Updated October 12, 2021