Baker-Jarvis, J.
and Riddle, B.
(2000),
Dielectric Measurements of Substrates and Packaging Materials, Proc., Intl. Conf. on High Density Interconnect and System Packaging, Denver, CO
(Accessed May 11, 2025)
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Dielectric Measurements of Substrates and Packaging Materials
Published
Author(s)
,
Abstract
We summarize measurement results on many polymer, ceramic, and composite substrate and packaging materials. Measurements on low-loss materials are obtained from closed and open cavity resonators, as well as dielectric-resonator methods. Measurements of the same material by different techniques are compared. Results indicate that consistent measurements can be obtained with a number of well-characterized fixtures.Proceedings Title
Proc., Intl. Conf. on High Density Interconnect and System Packaging
Conference Dates
April 26-28, 2000
Conference Location
Denver, CO
Pub Type
Conferences
Keywords
dielectric, electronic packaging, measurements, packaging materials, resonators, substrates
Citation
Issues
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Created March 31, 2000, Updated October 12, 2021