Dielectric Measurements of Substrates and Packaging Materials
James R. Baker-Jarvis, Billy F. Riddle
We summarize measurement results on many polymer, ceramic, and composite substrate and packaging materials. Measurements on low-loss materials are obtained from closed and open cavity resonators, as well as dielectric-resonator methods. Measurements of the same material by different techniques are compared. Results indicate that consistent measurements can be obtained with a number of well-characterized fixtures.
Proc., Intl. Conf. on High Density Interconnect and System Packaging
and Riddle, B.
Dielectric Measurements of Substrates and Packaging Materials, Proc., Intl. Conf. on High Density Interconnect and System Packaging, Denver, CO
(Accessed June 8, 2023)