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Dielectric Measurements of Substrates and Packaging Materials
Published
Author(s)
James R. Baker-Jarvis, Billy F. Riddle
Abstract
We summarize measurement results on many polymer, ceramic, and composite substrate and packaging materials. Measurements on low-loss materials are obtained from closed and open cavity resonators, as well as dielectric-resonator methods. Measurements of the same material by different techniques are compared. Results indicate that consistent measurements can be obtained with a number of well-characterized fixtures.
Proceedings Title
Proc., Intl. Conf. on High Density Interconnect and System Packaging
Baker-Jarvis, J.
and Riddle, B.
(2000),
Dielectric Measurements of Substrates and Packaging Materials, Proc., Intl. Conf. on High Density Interconnect and System Packaging, Denver, CO
(Accessed June 8, 2023)