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PUBLICATIONS

Dielectric Measurements of Substrates and Packaging Materials

Published

Author(s)

James R. Baker-Jarvis, Billy F. Riddle

Abstract

We summarize measurement results on many polymer, ceramic, and composite substrate and packaging materials. Measurements on low-loss materials are obtained from closed and open cavity resonators, as well as dielectric-resonator methods. Measurements of the same material by different techniques are compared. Results indicate that consistent measurements can be obtained with a number of well-characterized fixtures.
Proceedings Title
Proc., Intl. Conf. on High Density Interconnect and System Packaging
Conference Dates
April 26-28, 2000
Conference Location
Denver, CO
Pub Type
Conferences

Keywords

dielectric, electronic packaging, measurements, packaging materials, resonators, substrates
Electromagnetics

Citation

Baker-Jarvis, J. and Riddle, B. (2000), Dielectric Measurements of Substrates and Packaging Materials, Proc., Intl. Conf. on High Density Interconnect and System Packaging, Denver, CO (Accessed October 17, 2025)

Issues

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Created March 31, 2000, Updated October 12, 2021
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