TY  - CONF
AU  - James Baker-Jarvis
AU  - Billy Riddle
C2  - Proc., Intl. Conf. on High Density Interconnect and System Packaging, Denver, CO
DA  - 2000-04-01 00:04:00
LA  - en
PB  - Proc., Intl. Conf. on High Density Interconnect and System Packaging, Denver, CO
PY  - 2000
TI  - Dielectric Measurements of Substrates and Packaging Materials
ER  -