Okoro, C.
, Marro, J.
, Obeng, Y.
and Richardson, K.
(2014),
Defect and Microstructural Evolution in Thermally Cycled Cu Through-Silicon Vias, Microelectronics Reliability, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=915535
(Accessed February 19, 2025)