@article{12461,
  author = {Chukwudi Okoro and James Marro and Yaw Obeng and Kathleen Richardson},
  title = {Defect and Microstructural Evolution in Thermally Cycled Cu Through-Silicon Vias},
  year = {2014},
  month = {2014-06-14},
  publisher = {Microelectronics Reliability},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=915535},
  language = {en},
}