Williams, D.
, Chamberlin, R.
, Cheron, J.
, Chitwood, S.
, Willis, K.
, Butler, B.
and Yazdani, F.
(2020),
DARPA Organic Interconnect Characterization, DesignCon 2020 Proceedings, Santa Clara, CA, US, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=929182
(Accessed April 20, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
DARPA Organic Interconnect Characterization
Published
Author(s)
, , , Sam Chitwood, Ken Willis, Brad Butler, Farhang Yazdani
Abstract
We report on a study of interconnects fabricated on organic and silicon interposers used to connect state-of-the art digital, analog and RF chiplets commissioned by the U.S. Defense Advanced Research Projects Agency (DARPA). The interconnects were characterized with state-of- the-art on-wafer measurement methods developed at the National Institute of Standards and Technology (NIST) and then simulated with the Cadence Sigrity* simulation software package. The two-port, four-port and eight-port measurements and calibrations were performed to frequencies as high as 110 GHz using custom on-wafer calibrations to improve accuracy. We discuss the measurement and simulation methodologies and present detailed comparisons of the measurement and simulation results.Proceedings Title
DesignCon 2020 Proceedings
Conference Dates
January 28-30, 2020
Conference Location
Santa Clara, CA, US
Conference Title
DesignCon 2020
Pub Type
Conferences
Download Paper
Keywords
On-wafer measurement, hybrid solver, simulation
Citation
Created January 27, 2020, Updated March 7, 2022