TY  - CONF
AU  - Dylan Williams
AU  - Richard Chamberlin
AU  - Jerome Cheron
AU  - Sam Chitwood
AU  - Ken Willis
AU  - Brad Butler
AU  - Farhang Yazdani
C2  - DesignCon 2020 Proceedings, Santa Clara, CA, US
DA  - 2020-01-27 05:01:00
LA  - en
PB  - DesignCon 2020 Proceedings, Santa Clara, CA, US
PY  - 2020
TI  - DARPA Organic Interconnect Characterization
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=929182
ER  -