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Component Segregation in Model Chemically Amplified Resists



John T. Woodward IV, Theodore Fedynyshyn, David Astolfi, Susan Cann, Michael Leeson


We have applied chemical force microscopy (CFM) to probe the chemical segregation of resist materials. CFM is capable of providing simultaneous information about surface topography and chemical heterogeneity of partiallt developed resist films. We have used CFM to study ESCAP based resists that are used in 248 nm and extreme ultraviolet (EUV) lithography. We observe changes in both the material roughness and chemical heterogeneity of the resist with the introduction of PAG and with exposure and post exposure bake (PEB). We conclude that chemical segregation in the resist can influence the innate material roughness.
Proceedings Title
SPIE Proceedings | Advanced Lithography | 2007 | SPIE
Conference Dates
February 25-27, 2007
Conference Title
SPIE Proceedings


AFM, chemical force microscopy, line edge roughness, PAG, photoresist


Woodward, J. , Fedynyshyn, T. , Astolfi, D. , Cann, S. and Leeson, M. (2007), Component Segregation in Model Chemically Amplified Resists, SPIE Proceedings | Advanced Lithography | 2007 | SPIE, [online], (Accessed April 19, 2024)
Created March 15, 2007, Updated February 19, 2017