Sundaresan, S.
, Rao, M.
, Tian, Y.
, Schreifels, J.
, Wood, M.
, Jones, K.
and Davydov, A.
(2021),
Comparison of Solid-State Microwave Annealing With Conventional Furnace Annealing of Ion-Implanted SiC, Journal of Electronic Materials
(Accessed May 10, 2024)
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Comparison of Solid-State Microwave Annealing With Conventional Furnace Annealing of Ion-Implanted SiC
Published
Author(s)
, M V. Rao, Yong-lai Tian, John A. Schreifels, M. Wood, K Jones,
Abstract
Rapid solid-state microwave annealing was performed for the first time on N-, Al-, and B-implanted SiC and the results were compared with the conventional furnace annealing. For microwave annealing, temperatures > 2000 degree C were attained with heating rates exceeding 600 degree C/s. An 1850 degree C/35 s microwave anneal yielded an RMS surface roughness of 2 nm, which is lower than 6 nm obtained for 1500 degree C/15 min conventional furnace annealing. For the Al-implants, a minimum room temperature sheet resistance (R_subscript s}) of 7 k omega/square was measured upon microwave annealing. For the microwave annealing, Rutherford back-scattering measurements indicated a better structural quality and secondary-ion-mass-spectrometry boron implant depth profiles showed reduced boron redistribution compared to the corresponding results of the furnace annealing.Citation
Journal of Electronic Materials
Pub Type
Journals
Keywords
implantation, rapid thermal anneal, wide-band-gap semiconductors
Citation
Issues
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Created October 12, 2021