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Cavity optical transducer platform with integrated actuation for multiple sensing applications

Published

Author(s)

Thomas Michels, Vladimir Aksyuk

Abstract

We present an on-chip cavity optomechanical transducer platform that combines high measurement bandwidth and very low displacement noise floor with compactness, robustness, small size, and potential for low cost batch fabrication inherent in micro- electro- mechanical- systems (MEMS) [1]. The fiber-pigtailed transducers use surface-micromachined silicon on insulator photonic, low stress silicon nitride structural and metal electrical actuation layers, while front- and backside bulk micromachining defines v-grooves and overhanging cantilevers. The motion of the mechanical devices, such as cantilevers and high mechanical quality factor membrane resonators, is optically measured by integrated silicon micro disk optical cavities. The devices can be actuated electrothermally or electrostatically, which can also tune readout gain. Displacement noise floor below 10 fm/√Hz is achieved for mechanical devices with stiffness varying over three orders of magnitude (≈ 0.2 N/m to ≈ 200 N/m). The combination of electrical actuation, low-loss mechanics, and optomechanical readout may enable a wide variety of high performance on-chip resonant and non-resonant sensors.
Proceedings Title
Proceedings, Solid State Sensor, Actuator and Microsystems Workshop
Conference Dates
June 5-9, 2016
Conference Location
Hilton Head Island, SC, US
Conference Title
Hilton Head 2016 Workshop

Keywords

Optomechanics, Microfabrication, Cantilever

Citation

Michels, T. and Aksyuk, V. (2016), Cavity optical transducer platform with integrated actuation for multiple sensing applications, Proceedings, Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head Island, SC, US, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=920652 (Accessed December 3, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created June 4, 2016, Updated April 4, 2022