Calibration of Thin-Film Thermocouples on Silicon Wafers

Published

June 1, 1999

Author(s)

Kenneth G. Kreider, Dean C. Ripple, D P. DeWitt

Abstract

Thin-film thermocouples (TFTCs) can be fabricated from a much broader range of electrical conductors than wire thermocouples, but even with the same composition as the wire thermocouple, the TFTCs may have different thermoelectric coefficients. Also, the TFTCs are used to measure temperature differentials across short distances on the substrate and cannot be calibrated by standard procedures. Therefore, we at NIST have a continuing project to improve the calibration methods for TFTCs. We have developed a calibration test for TFTCs on 10 mm x 50 mm silicon wafer substrates using the comparison method up to 950 C with NIST calibrated, highly accurate, Platinum/palladium wire thermocouples as the reference thermometers. The expanded uncertainty (k = 2) for our method for calibration of the thin-film thermometers was less then 0.2% of the emf at 800 C.

Proceedings Title

TEMPMEKO '99, The 7th International Symposium on Temperature and Thermal Measurements in Industry and Science

Conference Dates

June 1-3, 1999

Conference Location

Delft, NL

Conference Title

International Symposium on Temperature and Thermal Measurements

Pub Type

Conferences

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Keywords

calibration, temperature measurement, thermocouples, thin films

Citation

Kreider, K. , Ripple, D. and DeWitt, D. (1999), Calibration of Thin-Film Thermocouples on Silicon Wafers, TEMPMEKO '99, The 7th International Symposium on Temperature and Thermal Measurements in Industry and Science, Delft, NL, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=830629 (Accessed June 22, 2025)