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Assessment of Reliability Concerns for Wide-Temperature Operation of Semiconductor Devices and Circuits

Published

Author(s)

Joseph Kopanski, David L. Blackburn, George G. Harman, David W. Berning
Proceedings Title
Proc., IEEE Components, Packaging, and Manufacturing Technology Society
Conference Location
San Diego, CA, USA

Citation

Kopanski, J. , Blackburn, D. , Harman, G. and Berning, D. (1996), Assessment of Reliability Concerns for Wide-Temperature Operation of Semiconductor Devices and Circuits, Proc., IEEE Components, Packaging, and Manufacturing Technology Society, San Diego, CA, USA (Accessed July 24, 2024)

Issues

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Created January 19, 1996, Updated October 12, 2021