TY  - CONF
AU  - Kopanski, Joseph
AU  - Blackburn, David
AU  - Harman, George
AU  - Berning, David
C2  - Proc., IEEE Components, Packaging, and Manufacturing Technology Society, San Diego, CA, USA
DA  - 1996-01-20 00:01:00
LA  - en
PB  - Proc., IEEE Components, Packaging, and Manufacturing Technology Society, San Diego, CA, USA
PY  - 1996
TI  - Assessment of Reliability Concerns for Wide-Temperature Operation of Semiconductor Devices and Circuits
ER  -