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3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules with Experimental Validation

Published

Author(s)

John V. Reichl, Jose M. Ortiz, Allen R. Hefner Jr., Jih-Sheng Lai
Citation
IEEE Transactions on Power Electronics
Volume
30

Citation

Reichl, J. , Ortiz, J. , Hefner, A. and Lai, J. (2015), 3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules with Experimental Validation, IEEE Transactions on Power Electronics, [online], https://doi.org/10.1109/TPEL.2014.2338278 (Accessed December 7, 2021)
Created January 16, 2015, Updated November 10, 2018