TY  - JOUR
AU  - John Reichl
AU  - Jose Ortiz
AU  - Allen Hefner
AU  - Jih-Sheng Lai
C2  - IEEE Transactions on Power Electronics
DA  - 2015-01-16
DO  - https://doi.org/10.1109/TPEL.2014.2338278
LA  - en
M1  - 30
PB  - IEEE Transactions on Power Electronics
PY  - 2015
TI  - 3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules with Experimental Validation
ER  -