@article{4426,
  author = {John Reichl and Jose Ortiz and Allen Hefner and Jih-Sheng Lai},
  title = {3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules with Experimental Validation},
  year = {2015},
  number = {30},
  month = {2015-01-16},
  publisher = {IEEE Transactions on Power Electronics},
  doi = {https://doi.org/10.1109/TPEL.2014.2338278},
  language = {en},
}