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Journals

The Role of Cu+3 in Oxygen Evolution Activity of Copper-Oxides

Author(s)
Pooja Basera, Yang Zhao, Angel Garcia-Esparza, Finn Babbe, Neha Bothra, John Vinson, Dimosthenis Sokaras, Junko Yano, Shannon Boettcher, Michal Bajdich
Cu-based oxides and hydroxides represent an important class of materials from a catalytic and corrosion perspective. In this study, we investigate the formation

Altermagnetic band splitting in 10 nm epitaxial CrSb thin films

Author(s)
Sandra Santhosh, Yongxi Ou, Paul Corbae, Wilson Yanez-Parreno, Supriya Ghosh, Alexei Fedorov, Makoto Hashimoto, Donghui Lu, Christopher Jensen, Julie Borchers, Alexander Grutter, Timothy Charlton, Anthony Richardella, K. A. Mkhoyan, Christopher Palmstrom, Nitin Samarth
Altermagnets are a newly identified family of collinear antiferromagnets with a momentum-dependent spin-split band structure of non-relativistic origin, derived

Multistage Networks for Glassy Holographic Photopolymers

Author(s)
Alexander Osterbaan, Andrew Sias, Marianela Trujillo-Lemon, Kieran Fung, Jason Killgore, ROBERT MCLEOD, Christopher Bowman
In the writing of holographic photopolymers, the addition of a third stage cure to the typical polyurethane matrix and acrylate writing monomer steps is used

Robust Nodal Behavior in the Thermal Conductivity of Superconducting UTe2

Author(s)
Ian Hayes, Tristin E. Metz, Corey Frank, Shanta R. Saha, Nicholas Butch, Vivek Mishra, P. Hirschfeld, Johnpierre Paglione
The superconducting state of the heavy-fermion metal UTe2 has attracted considerable interest because of evidence of spin-triplet Cooper pairing and nontrivial

Photolysis of the peptide bond at 193 and 222 nm

Author(s)
Nicholas Drachman, Jacob Vietorisz, Andrew Winchester, Rob Vest, Gregory Cooksey, Sujitra Pookpanratana, Derek Stein
Ultraviolet (UV) light is a well-established tool for fragmenting peptides in vacuum. This study investigates the fragmentation of peptides using 193 and 222 nm

Measuring Out-of-Plane Permittivity of Thin Films to Millimeter Wave Frequencies

Author(s)
Florian Bergmann, Meagan Papac, Benjamin Jamroz, Nicholas Jungwirth, Bryan Bosworth, Anna Osella, Tomasz Karpisz, Lucas Enright, Eric Marksz, Angela Stelson, Christian Long, Nathan Orloff, Robert Jones
Modern microchips utilize multilayer stack-ups with many interstitial layers of dielectrics. Optimizing device performance and maximizing yield requires precise

Interlaboratory Assessment of Candidate Reference Materials for Lentiviral Vector Copy Number and Integration Site Measurements

Author(s)
Hua-Jun He, Zhiyong He, Steven Lund, Barbara Paugh, Jennifer McDaniel, Justin Zook, Sierra Miller, Samantha Maragh, Simona Patange, Mahir Mohiuddin, Alessandro Tona, John Elliott, Kenneth Cole, Sheng Lin-Gibson
Reference materials are essential for accurately measuring integrated lentiviral vector (LV) copy number (VCN) and integration sites for the safety and efficacy
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