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Ran Tao, Polette Centellas, Stian Romberg, Anthony Kotula, Gale Holmes, Amanda Forster, Christopher Soles, Bob Allen, Edvin Cetegen, William Chen, Jeff Gotro, Mark Poliks
This perspective builds upon insights from the National Institute of Standards and Technology (NIST)-organized workshop, "Materials and Metrology Needs for
Polette Centellas, Stian Romberg, Ran Tao, Alexander Landauer, Karl Schoch, Huong Giang Nguyen, Gale Holmes, Gery Stafford, Christopher Soles
Residual stresses inevitably develop in thermosetting materials used for semiconductor packaging during the curing process and in service. Understanding the
Polette Centellas, Kyle Mehringer, Andrew Bowman, Katherine Evans, Parth Vagholkar, Travis Thornell, Liping Huang, Sarah Morgan, Christopher Soles, Yoan Simon, Edwin Chan
Understanding the physical and chemical response of materials to impulsive deformation is crucial for applications ranging from soft robotic locomotion to space
Christopher B. Cooper, McKenzie L. Coughlin, Polette J. Centellas, Aaron A. Burkey, Kalman D. Migler, Jonathan E. Seppala, Edwin P. Chan, Chad R. Snyder, Sara V. Orski
This dataset consists of characterization of telechelic functional polyethylene oligomers, precursors, and resultant step-growth polyethylene with urethane-linkages between segments of different
Polette Centellas, Stian Romberg, Gery Stafford, Karl F Schock, Jr., Huong Giang Nguyen, Ran Tao, Alexander K Landauer
This repository contains data generated to support and ECTC 2025 conference manuscript titled "Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging