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PUBLICATIONS

Controlling the Reaction Pathway to Tune Packaging Epoxy Properties

Published

Author(s)

Polette Centellas, Ran Tao, Andrew Korovich, Alexander Landauer, Amanda Forster, Siena Iavarone-Garza, Dante Ribeiro, Huong Giang Nguyen, Jan Obrzut, Stian Romberg, Christopher Soles

Abstract

Semiconductor packaging demands materials with precisely tuned properties. We demonstrate that the thermoset processing pathway strongly influences functional properties, including moisture and thermomechanical responses. Using a model epoxy system, our findings establish pathway control as a lever to engineer thermoset performance for reliable semiconductor packaging.
Proceedings Title
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Conference Dates
May 26-29, 2026
Conference Location
Orlando, FL, US
Pub Type
Conferences

Download Paper

https://doi.org/10.1109/ECTC51846.2026.00275
Local Download

Keywords

epoxy thermoset, thermal curing, moisture properties, coefficient of thermal expansion
Polymers and Materials characterization

Citation

Centellas, P. , Tao, R. , Korovich, A. , Landauer, A. , Forster, A. , Iavarone-Garza, S. , Ribeiro, D. , Nguyen, H. , Obrzut, J. , Romberg, S. and Soles, C. (2026), Controlling the Reaction Pathway to Tune Packaging Epoxy Properties, 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, US, [online], https://doi.org/10.1109/ECTC51846.2026.00275, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=961676 (Accessed July 28, 2026)
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Created May 26, 2026, Updated July 27, 2026
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