NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
https://www.nist.gov/people/gale-holmes
Gale A. Holmes (Fed)
Research Interests
Ballistic Fibers, Nano-Tailored Multi-functional Materials, Embedded Interfaces, Composite Micromechanics, Time-Dependent Relaxation Phenomena in Polymeric Systems
Awards and Honors
Department of Commerce Gold Medal (2007)
Chair Gordon Research Conference on Composites (2010)
Vice-Chair Gordon Research Conference on Composites (2008)
Gale A. Holmes, R C. Peterson, Donald L. Hunston, Walter G. McDonough
In this paper, we examine the regions of debonding between the fibers and the matrix surrounding fiber breaks formed during single-fiber fragmentation tests
Ran Tao, Polette Centellas, Stian Romberg, Anthony Kotula, Gale Holmes, Amanda Forster, Christopher Soles, Bob Allen, Edvin Cetegen, William Chen, Jeff Gotro, Mark Poliks
This perspective builds upon insights from the National Institute of Standards and Technology (NIST)-organized workshop, "Materials and Metrology Needs for
Anthony Kotula, Ran Tao, Jianwei Tu, Young Lee, Gale Holmes
Liquid encapsulants are versatile packaging materials that provide electrical insulation and mechanical protection for microelectronic devices. As more advanced
Polette Centellas, Stian Romberg, Ran Tao, Alexander Landauer, Karl Schoch, Huong Giang Nguyen, Gale Holmes, Gery Stafford, Christopher Soles
Residual stresses inevitably develop in thermosetting materials used for semiconductor packaging during the curing process and in service. Understanding the