Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant

Published

June 26, 2025

Author(s)

Anthony Kotula, Ran Tao, Jianwei Tu, Young Lee, Gale Holmes

Abstract

Liquid encapsulants are versatile packaging materials that provide electrical insulation and mechanical protection for microelectronic devices. As more advanced encapsulants are formulated to address modern packaging needs, advanced characterization techniques are required to identify and assess recommended cure schedules. Here, we demonstrate the capabilities of differential scanning calorimetry, Fourier transform infrared spectroscopy, and rheo-Raman spectroscopy to characterize a liquid encapsulant during thermal curing. The techniques demonstrate the ability to quantify overall cure kinetics, chemical component reaction, and time-dependent mechanical properties. Our results demonstrate that a prescribed cure schedule does not necessarily completely cure an encapsulant, meaning that the resulting package properties and overall reliability will be sensitive to cure history.

Conference Dates

May 27-30, 2025

Conference Location

Dallas, TX, US

Conference Title

2025 IEEE 75th Electronic Components and Technology Conference (ECTC)

Pub Type

Conferences

Download Paper

https://doi.org/10.1109/ECTC51687.2025.00303

Local Download

Keywords

microelectronics encapsulation, optoelectronics, cure kinetics, rheology, advanced packaging

Citation

Kotula, A. , Tao, R. , Tu, J. , Lee, Y. and Holmes, G. (2025), Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, US, [online], https://doi.org/10.1109/ECTC51687.2025.00303, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=959539 (Accessed July 10, 2025)