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Florian Bergmann, Meagan Papac, Benjamin Jamroz, Nicholas Jungwirth, Bryan Bosworth, Anna Osella, Tomasz Karpisz, Lucas Enright, Eric Marksz, Angela Stelson, Christian Long, Nathan Orloff, Robert Jones
Modern microchips utilize multilayer stack-ups with many interstitial layers of dielectrics. Optimizing device performance and maximizing yield requires precise
Nicholas Jungwirth, Bryan Bosworth, Meagan Papac, Aaron Hagerstrom, Eric Marksz, Jerome Cheron, Angela Stelson, Florian Bergmann, Ari Feldman, Dylan Williams, Christian Long, Nathan Orloff
We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and
Nicholas Jungwirth, Florian Bergmann, Bryan Bosworth, Jerome Cheron, Christian Long, Nathan Orloff
Fused silica has become an interesting alternative to silicon for millimeter-wave (mmWave) applications. Unfortunately, there are few reports on the measurement