November 20, 2024
      
                  
        
  Author(s)
  Nicholas  Jungwirth,   Bryan  Bosworth,   Meagan  Papac,   Aaron  Hagerstrom,   Eric  Marksz,   Jerome  Cheron,   Angela  Stelson,   Florian  Bergmann,   Ari  Feldman,   Dylan  Williams,   Christian  Long,   Nathan  Orloff
 
       
            
    
    
        We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and subsequently de-embeds the interconnect with a multi-tiered calibration. We experimentally