NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Wafer-Level Fabrication and Filling of Cesium-Vapor Resonance Cells for Chip-Scale Atomic Devices
Published
Author(s)
Li-Anne Liew, John M. Moreland, V Gerginov
Abstract
We describe the wafer-level fabrication of cesium vapor cells by evaporation and photolysis of cesium azide for chip-scale atomic devices. The advantage is that, unlike existing cell-fabrication methods which require fluid handling devices for filling individual and separately fabricated cells, here the filling step itself is done by thin-film deposition and thus integrated monolithically with the rest of the fabrication process.
Liew, L.
, Moreland, J.
and Gerginov, V.
(2006),
Wafer-Level Fabrication and Filling of Cesium-Vapor Resonance Cells for Chip-Scale Atomic Devices, Proceedings of 20th Eurosensors Conference, Goteborg, 1, SW, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=32413
(Accessed October 6, 2025)