Interconnection Continuity Test for Packaged Functional Modules

Published

March 3, 1998

Author(s)

Jan Obrzut

Abstract

We developed an electrical test to evaluate interconnections in packaged, electrostatic-discharge (ESD) protected modules. The ESD protection circuit, which in modern integrated circuits is present at every I/O as an inherent part of the chip structure, can be employed to create an electrical path through the interconnection without powering ON the internal circuitry of the chip. The technique utilizes a chip-specific voltage-current characteristic, and a model of the interconnection, from which the interconnection ohmic resistance can be directly obtained. The technique is applicable to a broad range of functional packages. Its sensitivity is comparable or better than the sensitivity of standard test techniques that utilize specialized test chips. This technique can also be used to test interconnections in failed IC s, since integrity of the internal circuitry is not required in this test.

Proceedings Title

AIP Conference Proceedings, Characterization and Metrology for ULSI Technology, vol 449, pp607-609 (1998)

Conference Dates

March 3, 1998

Conference Location

Gaithersburg, MD

Conference Title

Characterization and Metrology for ULSI Technology, 1998 International Conference

Pub Type

Conferences

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Keywords

chip carriers, electrostatic discharge protection, interconnection resistance, nonlinear resistance, statistical data analysis

Citation

Obrzut, J. (1998), Interconnection Continuity Test for Packaged Functional Modules, AIP Conference Proceedings, Characterization and Metrology for ULSI Technology, vol 449, pp607-609 (1998), Gaithersburg, MD, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=854051 (Accessed October 13, 2025)