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A Probe for Rapid and Flexible Evaluation of Photonic Integrated Circuits (PICs)

Published Patent Application Number: 19/223,455

Problem

TPOP optical probe.

Photonic integrated circuits (PICs) are similar to computer chips but operate with light instead of electricity. They are a next-generation technology with potential impacts in high-bandwidth communications, deployable sensors, and computing interconnects. Quality assurance and process control of PICs require light outcoupling of individual device components for in-line testing. Currently, these tests require large patterned areas on chips, which increases circuit size and manufacturing complexity. Light probes are a solution to this problem, where a specialized sub-micron-diameter fiber optic is placed in proximity to a light circuit device to perform tests. These probes are reusable and can be repositioned to test multiple devices for rapid sequential testing. While glass-based probes are currently under development, they require specialized handling and fabrication processes.

Invention

The Tapered Polymer Optical Probe (TPOP) is a state-of-the-art light probe that collects light from very small, localized areas. It is a small loop of a thin plastic "string" that collects light from a localized area near the loop into a fiber optic for signal testing. The probe is made of a durable polymer, and fabrication is facile and customizable using commercially available two-photon lithography direct laser write systems.

Potential Commercial Applications

  • Quality control in the manufacture of PICs for uses such as LiDAR, communications, sensing, and computing interconnects.
  • Probe for small, pure light sources (single photon emitters) used in quantum technologies.

Competitive Advantage

  • Easy fabrication: only one lithography step without the need for the controlled environment of a cleanroom.
  • Reproducible and customizable through the use of direct laser writing.
  • Polymer-based probes are inherently robust compared to previous glass-based probes.
  • Decrease time-to-market of light-based circuits by reducing complexity in design and in-line measurements.
  • Decrease of device component size in light-based circuits.  
Created December 16, 2025
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