Skip to main content

NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction

Published

Author(s)

Ran Tao, Sukrut Prashant Phansalkar, Aaron M. Forster, Bongtae Han

Abstract

Cure kinetics of epoxy molding compounds (EMCs) is a fundamental material property that affects the molding process of semiconductor chips and final package performance. However, due to measurement challenges related to the small polymer fraction, only the main reaction is considered in the current industry practice for EMC cure kinetics evaluation. In this work, we show that a second reaction exotherm is clearly identified in commercial multi-resin EMC systems upon dynamic heating scan using differential scanning calorimetry (DSC). The second reaction completes the overall reaction from about 0.8 to 1.0 fractional conversion, which is critical for designing cure schedules to achieve ultimate properties, especially the post-mold curing (PMC) procedure during manufacturing.
Proceedings Title
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
Conference Dates
May 30-June 2, 2023
Conference Location
Orlando, FL, US

Keywords

advanced packaging, microelectronics encapsulation, semiconductors, epoxy molding compound, cure kinetics, thermosets, glass transition, filled polymers

Citation

Tao, R. , Phansalkar, S. , Forster, A. and Han, B. (2023), Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, US, [online], https://doi.org/10.1109/ECTC51909.2023.00225, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936408 (Accessed October 2, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created August 3, 2023, Updated August 4, 2023
Was this page helpful?