@conference{1211246,
  author = {Ran Tao and Sukrut Prashant Phansalkar and Aaron M. Forster and Bongtae Han},
  title = {Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction},
  year = {2023},
  month = {2023-08-03 04:08:00},
  publisher = {2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, US},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936408},
  doi = {https://doi.org/10.1109/ECTC51909.2023.00225},
  language = {en},
}