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NanoFab Tool: Microwave Asher
The microwave plasma system is used for photoresist descum/removal and wafer cleaning. The system is equipped with a hand free door opening system for easy substrate loading/unloading.
Specifications/Capabilities
- Process gases: O2, N2 and CF4
- Frequency: 2.45 GHz
- Maximum Power: 1000 W
- Wafer diameters: up to 150 mm
- Small pieces supported: Yes
- Easy optical and e-beam resists removal
Usage Information
Operating Instructions
USER MANUAL
Typical Applications
- Photoresist removal/descum and wafer cleaning.
Created July 9, 2019, Updated March 4, 2025