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PUBLICATIONS

Nondestructive and Economical Dimensional Metrology of Deep Structures

Published

Author(s)

Ravikiran Attota, Hyeonggon Kang, Benjamin Bunday
Conference Dates
April 2-4, 2019
Conference Location
Monterey, CA
Conference Title
Frontiers of Characterization and Metrology for Nanoelectronics (FCMN)
Pub Type
Conferences

Download Paper

Local Download

Keywords

TSOM, nondestructive process control, three-dimensional metrology, through-focus scanning optical microscopy, nanometrology, packaging metrology, high-throughput semiconductor metrology
Metrology, Dimensional metrology, Nanotechnology and Optical physics and communications

Citation

Attota, R. , Kang, H. and Bunday, B. (2019), Nondestructive and Economical Dimensional Metrology of Deep Structures, Frontiers of Characterization and Metrology for Nanoelectronics (FCMN), Monterey, CA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=927455 (Accessed October 17, 2025)

Issues

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Created April 1, 2019, Updated January 27, 2020
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