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NanoFab Tool: SPTS Omega LPX Deep Silicon Etcher
Photograph of the SPTS Omega LPX Deep Silicon Etcher.
The SPTS Omega LPX deep silicon etcher is an inductively coupled plasma (ICP) etching system used for etching deep features in silicon. The tool uses a fast switching Bosch process that produces vertical sidewall profiles in the etched silicon. The manual load system can accommodate substrates ranging from 100 mm diameter wafers down to small pieces.
Specifications/Capabilities
- Primary RF power source: up to 3600 W.
- Secondary ICP power source: up to 2000 W.
- Platen HF power source: up to 200 W.
- Process Gases: Ar, N2, He, O2, C4F8 and SF6.
Usage Information
Supported Sample Sizes
- Maximum wafer diameter: 100 mm.
- Small pieces supported: Yes.
Typical Applications
- Microelectromechanical systems (MEMS).
- Nanoelectromechanical systems (NEMS).
- Through silicon via (TSV) for three dimensional integration.
- Microfluidic devices.