The CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF), an NSTC and NAPMP facility, is expected to be located the Arizona State University (ASU) Research Park in Tempe, Arizona.

This award aims to support Arizona State University in developing the next generation of microelectronics packaging through fan-out-wafer-level processing and exploring the commercial vitality of 300mm wafer-level and 600mm panel-level manufacturing.

MCCCD will use anticipated funding to expand its semiconductor technician training offerings and launch the Maricopa Accelerated Semiconductor Training (MAST) program, building on the success of the Quick Start program.

The CHIPS for America award will provide Amkor Technology Peoria, Arizona up to $900 million in total direct funding under the CHIPS and Science Act to support the construction of a new advanced packaging and testing facility ensuring a reliable domestic advanced packaging ecosystem, supporting leading-edge clusters, and helping meet the growing demand for AI chips.

The CHIPS for America award will provide the company with up to $6.6 billion in total direct funding under the CHIPS and Science Act to support the company’s planned investment of more than $65 billion in three greenfield leading-edge fabs in Phoenix, Arizona.

The CHIPS for America award will provide Intel Arizona up to $3.94 billion in total direct funding under the CHIPS and Science Act to support the construction of two new leading-edge logic fabs and modernization of one existing fab, significantly increasing leading-edge logic capacity, including high volume domestic production of Intel 18A – the company’s most advanced chip design that enables higher performing, leading-edge chips through RibbonFET gate-all-around transistors and PowerVia backside power delivery.