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Zeroing in on a Lead-Free Solder Database

Published

Author(s)

Thomas A. Siewert, David R. Smith

Abstract

The rising interest in lead-free solders creates a need for complete property data on the various lead-free solder compositions. Circuit designers need these data to assess the impact of the transition on product life, and production engineers need these data to determine processing parameters. Various types of data are available, but are widely dispersed through the literature. To improve the sharing of this important information, we developed an on-line database for solder properties emphasizing new lead-free solders. One problem with combining data from many sources was that variations in test procedures led to undesirable scatter.
Citation
Welding Journal

Keywords

copper, intemetallics, lead-free solders, silver, solder, tin

Citation

Siewert, T. and Smith, D. (2005), Zeroing in on a Lead-Free Solder Database, Welding Journal, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50183 (Accessed July 15, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created October 1, 2005, Updated January 27, 2020