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X-Ray Tomography of Integrated Circuit Interconnects: Past and Future

Published

Author(s)

Zachary H. Levine

Abstract

An Al-W-silica integrated circuit interconnect sample was thinned to several micro υ and scanned across a 200 nm focal spot of a Fresnel zone plate operating at photon energy of 1573 eV. The experiment was performed on beamline 2-ID-B of the Advanced Photon Source, a third-generation synchrotron facility. Thirteen scanned projections of the sample were acquired over the angular range of + 69.2 . At least 301 x 301 pixels were acquired at each angle with a step size of 77 X 57 nm. A three-dimensional image with an approximate uncertainty of 400 nm was reconstructed from projection data using a standard algorithm. The two layers of the integrated circuit and the presence of the focused ion beam markers on the surface of the sample are clearly shown in the reconstruction.
Proceedings Title
International Symposium for Testing and Failure Analysis | 27th | ISTFA 2001: Proceedings of the the 27th International Symposium for Testing and Failure Analysis
Conference Dates
November 11-15, 2001
Conference Location
Santa Clara, CA
Conference Title
ASM International

Keywords

integrated circuit interconnect, microtomography, tomography

Citation

Levine, Z. (2001), X-Ray Tomography of Integrated Circuit Interconnects: Past and Future, International Symposium for Testing and Failure Analysis | 27th | ISTFA 2001: Proceedings of the the 27th International Symposium for Testing and Failure Analysis, Santa Clara, CA (Accessed June 21, 2024)

Issues

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Created November 1, 2001, Updated February 17, 2017