Shivesh, S.
, Gaitan, M.
, Yogendra, J.
and Harman, G.
(2005),
Wire Bonding Process Monitoring using Thermopile Temperature Sensor, IEEE Transactions on Advanced Packaging, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31506
(Accessed February 8, 2025)