@article{795651,
  author = {Suman Shivesh and Michael Gaitan and Joshi Yogendra and George Harman},
  title = {Wire Bonding Process Monitoring using Thermopile Temperature Sensor},
  year = {2005},
  number = {28},
  month = {2005-11-17 00:11:00},
  publisher = {IEEE Transactions on Advanced Packaging},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31506},
  language = {en},
}