TY  - JOUR
AU  - Suman Shivesh
AU  - Michael Gaitan
AU  - Joshi Yogendra
AU  - George Harman
C2  - IEEE Transactions on Advanced Packaging
DA  - 2005-11-17 00:11:00
LA  - en
M1  - 28
PB  - IEEE Transactions on Advanced Packaging
PY  - 2005
TI  - Wire Bonding Process Monitoring using Thermopile Temperature Sensor
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31506
ER  -