Harman, G.
(1996),
Wire Bonding to Multichip Modules and Other Soft Substrates, Multichip Modules with Integrated Sensors, Kluwer Academic Publishers,
(Accessed December 13, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Wire Bonding to Multichip Modules and Other Soft Substrates, Multichip Modules with Integrated Sensors
Published
Author(s)
Citation
W. K. Jones and G. Harsanyi Eds.
Publisher Info
Kluwer Academic Publishers,
Pub Type
Books
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created December 31, 1996, Updated February 17, 2017