TY  - SER
AU  - Harman, George
C2  - Kluwer Academic Publishers,  
DA  - 1996-12-31
LA  - en
PB  - Kluwer Academic Publishers,  
PY  - 1996
TI  - Wire Bonding to Multichip Modules and Other Soft Substrates, Multichip Modules with Integrated Sensors
ER  -