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Wire Bonding to Multichip Modules and Other Soft Substrates
Published
Author(s)
George G. Harman
Proceedings Title
Proc., 1995 International Conference on Multichip Modules
Conference Dates
April 19-21, 1995
Conference Location
Denver, CO
Pub Type
Conferences
Citation
Harman, G.
(1995),
Wire Bonding to Multichip Modules and Other Soft Substrates, Proc., 1995 International Conference on Multichip Modules, Denver, CO
(Accessed June 4, 2023)