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PUBLICATIONS

Wire Bonding to Multichip Modules and Other Soft Substrates

Published

Author(s)

George G. Harman
Proceedings Title
Proc., 1995 International Conference on Multichip Modules
Conference Dates
April 19-21, 1995
Conference Location
Denver, CO
Pub Type
Conferences

Citation

Harman, G. (1995), Wire Bonding to Multichip Modules and Other Soft Substrates, Proc., 1995 International Conference on Multichip Modules, Denver, CO (Accessed October 14, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created December 31, 1995, Updated February 17, 2017
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