Harman, G.
(1995),
Wire Bonding to Multichip Modules and Other Soft Substrates, Proc., 1995 International Conference on Multichip Modules, Denver, CO
(Accessed June 4, 2023)
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Wire Bonding to Multichip Modules and Other Soft Substrates
Published
Author(s)
Proceedings Title
Proc., 1995 International Conference on Multichip Modules
Conference Dates
April 19-21, 1995
Conference Location
Denver, CO
Pub Type
Conferences
Citation
Created December 31, 1995, Updated February 17, 2017