TY  - CONF
AU  - George Harman
C2  - Proc.,  1995 International Conference on Multichip Modules, Denver, CO
DA  - 1995-12-31
LA  - en
PB  - Proc.,  1995 International Conference on Multichip Modules, Denver, CO
PY  - 1995
TI  - Wire Bonding to Multichip Modules and Other Soft Substrates
ER  -